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  r09ds0053ej0300 rev.3.00 page 1 of 9 nov 22, 2012 the mark shows major revised points. the revised points can be easily searched by copying an "" in the pdf file and specifying it in the "find what:" field. data sheet pg2185t6r gaas integrated circuit spdt switch for 2 ghz to 6 ghz description the pg2185t6r is a gaas mmic spdt (s ingle p ole d ouble t hrow) switch which was designed for 2 ghz to 6 ghz applications, including dual-band wireless lan. this device can operate frequency from 2 ghz to 6 ghz, having the low insertion loss and high isolation. this device is housed in a 6-pin plastic tsson (t hin s hrink s mall o ut-line n on-leaded) (t6r) package and is suitable for high-density surface mounting. features ? operating frequency : f = 2.0 to 6.0 ghz ? switch control voltage : v cont (h) = 1.8 to 3.6 v (3.0 v typ.) : v cont (l) = ? 0.2 to 0.2 v (0 v typ.) ? low insertion loss : l ins 1 = 0.40 db typ. @ f = 2.0 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins 2 = 0.50 db typ. @ f = 2.5 to 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? high isolation : isl1 = 26 db typ. @ f = 2.0 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl2 = 25 db typ. @ f = 2.5 to 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? handling power : p in (1 db) = +30.5 dbm typ. @ f = 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : p in (1 db) = +30.5 dbm typ. @ f = 6.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v ? high-density surface mounting : 6-pin plastic tsson (t6r) package (1.0 1.0 0.37 mm) applications ? wireless lan (ieee802.11a/b/g/n) ? uwb, near field communications ordering information part number order number package marking supplying form pg2185t6r-e2 pg2185t6r-e2-a 6-pin plastic tsson (pb-free) g8 ? embossed tape 8 mm wide ? pin 1, 6 face the perforation side of the tape ? qty 5 kpcs/reel remark to order evaluation samples, please contact your nearby sales office. part number for sample order: pg2185t6r caution although this device is designed to be as robust as possi ble, esd (electrostatic discharge) can damage this device. this device must be protected at all times from esd. static charges may eas ily produce potentials of several kilovolts on the human body or equipment, whic h can discharge without detection. industry-standard esd precautions must be employed at all times. r09ds0053ej0300 rev.3.00 nov 22, 2012
pg2185t6r r09ds0053ej0300 rev.3.00 page 2 of 9 nov 22, 2012 pin connections and inte rnal block diagram pin no. pin name 1 output1 2 gnd 3 output2 4 v cont 2 5 input (top view) (bottom view) 1 2 3 4 5 6 1 2 3 4 5 6 1 2 3 4 5 6 (top view) g8 6 v cont 1 remark exposed pad : gnd truth table v cont 1 v cont 2 input ? output1 input ? output2 high low off on low high on off absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit switch control voltage v cont +6.0 note v input power p in +31 dbm power dissipation p d 150 mw operating ambient temperature t a ? 40 to +90 c storage temperature t stg ? 55 to +150 c note: ? v cont 1 ? v cont 2 ? 6.0 v recommended operating range (t a = +25 c, unless otherwise specified) parameter symbol min. typ. max. unit switch control voltage (h) v cont (h) 1.8 3.0 3.6 v switch control voltage (l) v cont (l) ? 0.2 0 +0.2 v operating frequency f 2.0 ? 6.0 ghz
pg2185t6r r09ds0053ej0300 rev.3.00 page 3 of 9 nov 22, 2012 electrical characteristics 1 (t a = +25 c, v cont (h) = 3.0 v, v cont (l) = 0 v, z o = 50 , dc blocking capacitors = 6 pf, unless otherwise specified) parameter symbol test condi tions min. typ. max. unit insertion loss 1 l ins 1 f = 2.0 to 2.5 ghz ? 0.40 0.60 db insertion loss 2 l ins 2 f = 2.5 to 6.0 ghz ? 0.50 0.80 db isolation 1 (input ? off port) isl1 f = 2.0 to 2.5 ghz 23 26 ? db isolation 2 (input ? off port) isl2 f = 2.5 to 6.0 ghz 22 25 ? db isolation 3 (output1 ? output2) isl3 f = 2.0 to 2.5 ghz 24 27 ? db isolation 4 (output1 ? output2) isl4 f = 2.5 to 6.0 ghz 24 27 ? db input return loss 1 rl in 1 f = 2.0 to 2.5 ghz 15 20 ? db input return loss 2 rl in 2 f = 4.9 to 6.0 ghz 15 20 ? db input return loss 3 rl in 3 f = 2.5 to 4.9 ghz 12 17 ? db output return loss 1 rl out 1 f = 2.0 to 2.5 ghz 15 20 ? db output return loss 2 rl out 2 f = 4.9 to 6.0 ghz 15 20 ? db output return loss 3 rl out 3 f = 2.5 to 4.9 ghz 12 17 ? db 0.1 db loss compression p in (0.1 db) f = 2.5 ghz +26 +29 ? dbm input power note f = 6.0 ghz +26 +29 ? dbm 1 db loss compression p in (1 db) f = 2.5 ghz ? +30.5 ? dbm input power note f = 6.0 ghz ? +30.5 ? dbm input 3 rd order intercept point iip 3 f = 2.5 ghz ? +50 ? dbm switch control current i cont no rf input ? 0.1 1.0 a switch control speed t sw 50% ctl to 90/10% rf ? 20 100 ns note: p in (0.1 db) is the measured input power level when the inserti on loss increases 0.1 db more than that of the linear range. p in (1 db) is the measured input power level when the inserti on loss increases 1 db more than that of the linear range. caution it is necessary to use dc blocking capacitors with this device. the value of dc blocking capacitors should be ch osen to accommodate the frequency of operation, bandwidth, switching speed and the conditi on with actual board of your system.
pg2185t6r r09ds0053ej0300 rev.3.00 page 4 of 9 nov 22, 2012 electrical characteristics 2 (t a = +25 c, v cont (h) = 1.8 v, v cont (l) = 0 v, z o = 50 , dc blocking capacitors = 6 pf, unless otherwise specified) parameter symbol test condi tions min. typ. max. unit insertion loss 1 l ins 1 f = 2.0 to 2.5 ghz ? 0.40 0.60 db insertion loss 2 l ins 2 f = 2.5 to 6.0 ghz ? 0.50 0.80 db isolation 1 (input ? off port) isl1 f = 2.0 to 2.5 ghz 22 26 ? db isolation 2 (input ? off port) isl2 f = 2.5 to 6.0 ghz 22 25 ? db isolation 3 (output1 ? output2) isl3 f = 2.0 to 2.5 ghz 22 27 ? db isolation 4 (output1 ? output2) isl4 f = 2.5 to 6.0 ghz 22 27 ? db input return loss 1 rl in 1 f = 2.0 to 2.5 ghz 15 20 ? db input return loss 2 rl in 2 f = 4.9 to 6.0 ghz 15 20 ? db input return loss 3 rl in 3 f = 2.5 to 4.9 ghz 12 17 ? db output return loss 1 rl out 1 f = 2.0 to 2.5 ghz 15 20 ? db output return loss 2 rl out 2 f = 4.9 to 6.0 ghz 15 20 ? db output return loss 3 rl out 3 f = 2.5 to 4.9 ghz 12 17 ? db 0.1 db loss compression p in (0.1 db) f = 2.5 ghz +20 +23 ? dbm input power note f = 6.0 ghz +19 +23 ? dbm 1 db loss compression p in (1 db) f = 2.5 ghz ? +28 ? dbm input power note f = 6.0 ghz ? +27 ? dbm input 3 rd order intercept point iip 3 f = 2.5 ghz ? +50 ? dbm switch control current i cont no rf input ? 0.1 1.0 a switch control speed t sw 50% ctl to 90/10% rf ? 20 100 ns note: p in (0.1 db) is the measured input power level when the inserti on loss increases 0.1 db more than that of the linear range. p in (1 db) is the measured input power level when the inserti on loss increases 1 db more than that of the linear range. caution it is necessary to use dc blocking capacitors with this device. the value of dc blocking capacitors should be ch osen to accommodate the frequency of operation, bandwidth, switching speed and the conditi on with actual board of your system.
pg2185t6r r09ds0053ej0300 rev.3.00 page 5 of 9 nov 22, 2012 evaluation circuit output1 output2 6 pf 6 pf v cont 1 input 1 000 pf 1 000 pf 6 pf v cont 2 12 5 6 3 4 the application circuits and their parameters are for refere nce only and are not intended for use in actual design-ins. application information l esd c1 c1 c1 switch ? c1 are dc blocking capacito rs external to the device. the value may be tailored to provide specific electrical responses. ? the rf ground connections should be kept as short as possible and connected to directly to a good rf ground for best performance. ? l esd provides a means to increase the esd protection on a sp ecific rf port, typically the port attached to the antenna.
pg2185t6r r09ds0053ej0300 rev.3.00 page 6 of 9 nov 22, 2012 mounting pad and solder mask layout dimensions 6-pin plastic tsson (t6r) (unit: mm) mounting pad solder mask solder thickness : 0.08 mm 1.2 0.125 0.225 1.2 0.15 0.15 0.15 0.15 0.225 0.6 1.15 0.13 0.13 0.13 0.15 1.15 0.45 0.65 0.35 0.35 0.75 0.45 0.35 0.35 0.75 remark the mounting pad and solder mask layouts in this document are for reference only.
pg2185t6r r09ds0053ej0300 rev.3.00 page 7 of 9 nov 22, 2012 package dimensions 6-pin plastic tsson (t6r) (unit: mm) 1.00.1 0.350.06 0.350.06 0.45 0.1 0.130.07 0.15 +0.07 ?0.05 0.08 min. 0.230.07 0.1750.075 (bottom view) (top view) 1.00.1 1.00.1 1.00.1 0.37 +0.03 ?0.05 0.15 +0.07 ?0.05 0.08 min. a a a a remark a > 0
pg2185t6r r09ds0053ej0300 rev.3.00 page 8 of 9 nov 22, 2012 recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below ir260 partial heating peak temperature (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).
pg2185t6r r09ds0053ej0300 rev.3.00 page 9 of 9 nov 22, 2012 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposi ng of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subjec t to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history pg2185t6r data sheet description rev. date page summary 1.00 may 30, 2008 ? first edition issued 2.00 aug 22, 2008 ? second edition issued all the format of renesas electronics corporation is applied to this data sheet. p.1 the value of switch control voltage ( v cont (h) ) is changed to ?1.8 to 3.6 v?. p.2 the minimum and maximum values of switch control voltage ( v cont (h) ) are changed to 1.8 v and 3.6v, respectively. p.4 electrical characteristics 2 is added. p.5 application information is added. 3.00 nov 22, 2012 p.8 the ?wave soldering? is deleted from recommended soldering conditions.
notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". t he recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti-crime systems; and safety equipment etc. renesas electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat t o human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). you mus t check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application for which it is not intended. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for which the product is not intended by renesas electronics. 6. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas e lectronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 7. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance desig n. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatib ility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufactu re, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. you should not use renesas electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. when exporting the renesas electronics products or technology described in this do cument, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. it is the responsibility of the buyer or distributor of renesas electronics products, who distributes, disposes of, or othe rwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, renesas electronics assumes no responsibility for any losses incurred by yo u or third parties as a result of unauthorized use of renesas electronics products. 11. this document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of renesa s electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. 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